For popular high speed components like semiconductor packages, and test contactors, we have developed standard fixturing which allows the use of high bandwidth microprobes to measure virtually any I/O pin, according to GigaTest's methodology and requirements.

These fixtures are typically 2-layer, or multi-layer precision PCBs, with mounting pads for attaching the DUT. For BGA packages, the sample is soldered to the board. For pogo-pin contactors and test sockets, the sample is screwed down, with alignment holes ensuring a proper contact to the fixture. Probing is then accomplished from the "back" side of the test board, where via pads are surrounded by ground plane. This probe launch is designed to accommodate the use of 450u pitch Ground/Signal probes, and provides a very good signal launch for TDR and VNA measurements. The fixtures also have via measurement coupons for de-embedding the effects of the PCB from the measurement.