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GTL 130a, b - Transmission Line Characterization and Design
  GTL 130a: Transmission Line Characterization with TDR
GTL 130b: Transmission Line Stack Up Design
 

This two day, lecture/demo course, focuses on practical design methods to optimize the stack up of circuit boards to achieve target values of characteristic impedance, cross talk and differential impedance, and how to verify these and other properties with TDR (Time Domain Reflectometer). The techniques taught in this course can be applied to all laminate substrates, including printed circuit boards, thick film ceramic, cofired ceramic, organic and ceramic BGAs, thin film multilayer substrates and on chip interconnects.

In this course, we review the tools and methodology that will enable you to accurately predict board performance, identifying the first and second order geometry and material factors that affect the electrical properties. We leverage four valuable tools: rules of thumb, approximations, field solvers, and TDR. Each of these is an important tool that should be in the toolbox of every engineer.

We illustrate that when accuracy is important, a 2D field solver is an essential tool. Using a very accurate, easy to use, commercially available field solver, we show how to use this tool to calculate the characteristic impedance, cross talk and differential impedance of many different cross sections. After this course, every participant will be immediately productive with a field solver. Students should bring their laptops to participate in the demos.

Using technques taught in this class, accurate values of the characteristic impedance, time delay, dielectric contant, near and cross talk, far end cross talk, differential impedance and common impedance of transmission line structures can be directly measured. Models are created for discontinuities such as vias, gaps in the return path, stubs and connectors. The important artifacts such as from the probes, cables, connectors and launch points are studied and techniques to minimize these problems are taught. The use of extraction software that greatly improves the accuracy and quality of high bandwidth models is demonstrated.

This is an introductory level course, suitable for all levels of engineers.

This class is taught by Dr. Eric Bogatin.

 
 
  Day One

GTL 130a: Transmission Line Characterization with TDR

Characteristic Impedance and Time Delay
Impedance changes, reflections and TDR
Common artifacts
Measuring characteristic impedance of microstrip, stripline and cables
Time delay, effective dielectric constant and bulk dielectric constant
Demo: measuring impedance, characteristic impedance and dielectric constant

Models of Discontinuities
Reflections from L and C discontinuities
Extracting models of bends, pads, and vias
Extracting models of connectors and engineering change wires
Extracting models of return path discontinuities
Demo: extracting models of transmission lines with discontinuities

Lunch (Provided)

Measuring Cross Talk
Measuring NEXT and FEXT
Rise time effects
Cross talk and board stack up
Cross talk and terminations
Demo: measuring cross talk in microstrip and stripline structures

Measuring Differential Impedance
Impedance while differential and common driving
Measuring differential impedance
Measuring common impedance
Effects of terminations
Demo: measuring differential impedance in microstrip and stripline

 

Day Two

GTL 130b: Transmission Line Stack Up Design

Controlled Impedance and First Order Effects
The three levels of analysis
Bandwidth limitations for characteristic impedance
Popular approximations for characteristic impedance and their accuracy
Tolerance analysis for manufacturing controlled impedance boards
Demo: calculating characteristic impedance of PCB traces, twisted pair and coax cable

Controlled Impedance and Design with a Field Solver
2D and other field solvers
Establishing accuracy of 2D field solvers
Role of solder mask thickness and other second order effects
Effect of trace thickness and etch back
Demo: using a 2D field solver to calculate characteristic impedance

Lunch (Provided)

Reducing Cross Talk
NEXT and FEXT as figures of merit
Using a 2D field solver to calculate cross talk
Effects stackup, spacing and materials
Use of guard traces
Demo: calculating cross talk for microstrip and stripline with a field solver

Designing Differential impedance
Using a 2D field solver to calculate differential impedance
Differential impedance and coupling
Differential impedance and stack up
Approximations for differential impedance
Demo: calculating differential impedance for microstrip and stripline with a field solver

For information on hotels in the vicinity, click here.
You may print these pages and use them as a quote.
To check the schedule or enroll for this course, click here.
 
For more information, contact:
Gary Otonari
GigaTest Labs
134 S. Wolfe Rd
Sunnyvale, CA 94086
FAX 408-524-2700
V: 408-524-2700
garyo@gigatest.com
 
 
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