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This two day, lecture/demo course, focuses on how the physical
design and layout of signal traces, planes
and cables influence signal integrity and EMI.
Termination, layout and design strategies
are taught to minimize signal integrity problems early in the
design cycle.
The important first order effects of controlled impedance, controlled
differential impedance, switching noise, cross talk, lossy lines
and signal distortion from impedance discontinuities are all thoroughly
reviewed. The important second order effects, such as return plane
selection, switching noise form changing reference planes, serpentine
delay lines, and distortion from vias and corners, are also included.
All of the principles taught in this course apply to printed circuit
boards and cofired ceramic and organic laminate based BGA packages.
Finally, we review the basic principles of EMI including the generation
and control of common and differential currents and the three main
sources for achieving electromagnetic compatibility(EMC): bandwidth
control, board level design and system level design.
Specific design rules to meet clock frequencies in excess of 1
GHz are presented. In addition, a methodology is taught that can
be applied to all high-speed board designs. This is based on leveraging
two processes: measurement and analysis. Measurements using TDR
and VNA are demonstrated. The three levels of analysis: rules of
thumb, approximations and numerical simulation tools are used to
analyze how physical design affects signal quality.
This is not a basics course. Extensive use is made of simulation
tools and numerical examples. This is a practical engineering course
for the design engineer who must solve circuit board layout and
design problems on a regular basis. It is recommended that engineers
who do not have a firm understanding of the basic concepts in signal
integrity take the GigaTest Labs courses GTL122
and GTL130.
This class is taught by Dr.
Eric Bogatin
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