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This two day, lecture/demo course, thoroughly reviews the practical
use of measurements to create and verify high bandwidth
models of interconnects. Measurements include impedance
analyzer, network analyzer and TDR. Interconnect
examples include wire bonds, rf packages, BGAs,
connectors, printed circuit board traces, board
level discontinuities, lossy lines, coupled lines
and differential pairs. Accurate measurements above 10
GHz and below 100 psec rise times are demonstrated on these and
other structures, in the class.
Why this class is important for you: The electrical performance
of interconnects dramatically affects signal integrity in all high-speed
digital, rf and telecomm applications today. In order to meet the
shrinking time to market window, it is important to be able to predict
the performance of a product before it is released to manufacture.
The first step is to create an equivalent electrical circuit model
that is accurate up to the application bandwidth. Measurements provide
one path to create models and are the ultimate verification of the
accuracy of any high bandwidth model.
Level: This course emphasizes the practical methods and
techniques of performing and interpreting high bandwidth measurements.
Other than the use of real and imaginary components, the mathematics
is kept to an absolute minimum. Most calculations are performed
using off the shelf simulation tools. In this way, this course is
suitable to all levels of engineers involved in high bandwidth design.
An advanced degree is not required. However, it is recommended that
engineers who do not have a firm understanding of the basic concepts
in signal integrity take GTL122.
This course does NOT cover, the basic concepts and theory associated
with signal integrity and interconnect design, optimizing the design
of interconnects, or models of drivers. These, and many more topics
are covered in other GigaTest Labs courses.
This class is taught by Dr.
Eric Bogatin
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